|
Twitter
|
Facebook
|
Google+
|
VKontakte
|
LinkedIn
|
 
 
International Journal of Innovation and Scientific Research
ISSN: 2351-8014
 
 
Wednesday 21 November 2018

About IJISR

News

Submission

Downloads

Archives

Custom Search

Contact

Connect with IJISR

   
 
 
 

DESIGN OF LEE'S DISC ELECTRICAL METHOD FOR DETERMINING THERMAL CONDUCTIVITY OF A POOR CONDUCTOR IN THE FORM OF A FLAT DISC


Volume 9, Issue 2, September 2014, Pages 335–343

 DESIGN OF LEE'S DISC ELECTRICAL METHOD FOR DETERMINING THERMAL CONDUCTIVITY OF A POOR CONDUCTOR IN THE FORM OF A FLAT DISC

Paul Philip and Layi Fagbenle

Original language: English

Received 10 August 2014

Copyright © 2014 ISSR Journals. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract


This experiment was carried out to design modified Lee's disc method of measuring the thermal conductivity of a poor conductor in the form of a flat disc. The modified Lee's disc set-up is equipped with various types of electrical device and probes. The components used to implement the design were chosen because of their ability to withstand high voltage and temperature levels. Most of these instruments are utilized in industrial settings. The designed instrument was used to test the thermal conductivity of some low insulating materials. The value of k which is the rate of flow of heat through a material per unit area per unit temperature gradient was determined. The units of k are Wm-1K-1 (from Js-1m-1K-1). The thermal conductivity of the selected materials was tested to validate the effectiveness of the modified design.

Author Keywords: Conductor, heat transfer, Lee disc, temperature and thermal conductivity.


How to Cite this Article


Paul Philip and Layi Fagbenle, “DESIGN OF LEE'S DISC ELECTRICAL METHOD FOR DETERMINING THERMAL CONDUCTIVITY OF A POOR CONDUCTOR IN THE FORM OF A FLAT DISC,” International Journal of Innovation and Scientific Research, vol. 9, no. 2, pp. 335–343, September 2014.